Recent posts

• Intecsea Presentation in the ANSYS UK Innovation conference
• Gompute sponsoring the OpenFOAM Iberian meeting
• Gompute user group meeting 2019
• Gompute exhibiting at the Siemens PLM Software 2018 Simcenter Conference, December 3-5, Prague
• Meet the Gompute team at the Ansys Innovation Conference in Goteborg, Sweden – Nov 20 and 21, 2018
• Meet the Gompute team at the Ansys Innovation conference in Madrid, Spain-November 15, 2018
• Meet the Gompute team at SC18, booth 3018
• Gompute user meeting 2018
• MIT and IPC running OpenFoam in Gompute
• Gompute sponsoring at Ansys Innovation Conference
• Gompute sponsoring the 2017 Eindhoven Convergence Conferences
• Gompute presenting at the Ensight European Conference
• Meet the Gompute team at SC17
• XFlow user conference, Madrid, October 2-3 2017
• Gompute sponsoring the Nordic LS-DYNA Information Day 2017
• Gompute presenting at the BETA CAE International conference
• Gompute sponsoring the 2º FOAM@PT / 1º FOAM IBÉRICO
• Gompute bronze sponsor at the Science in the Age of Experience, May 15-18, 2017 Chicago, IL
• European LS-DYNA Conference 2017
• ANSYS UK 2017 Customer Day
• Gompute user meeting 2017
• Gompute Sponsoring the LS-DYNA nordic users conference
• Gompute presenting at DANSIS
• Gompute Gold sponsor at the German LS-DYNA Forum 2016
• Gompute presenting at the Ansys HPC Cloud seminar in Israel
• Gompute presenting at the UK Ansys HPC seminar
• Invenco and Gompute
• Formtech and Gompute
• OFW11
• Gompute user meeting 2016