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New C6 bare metal nodes coming soon

Gompute is expanding with a new generation of computing nodes for CAE applications, based on 4th Generation AMD EPYC™ Processors. Announced in November 2022, the 4th Gen AMD EPYC offers a significant upgrade in core performance, translating into a faster time to the...

Gompute at the Nordic LS-DYNA User´s conference

Just one week after the German LS-DYNA Forum, this time the Gompute team will be exhibiting at the Nordic conference, the place to exchange experiences and learn new developments on ANSYS LS-DYNA. Do not miss the opportunity to learn how the Gompute Cloud can...

Gompute Workshop at the Automotive CAE Grand Challenge Event.

Hanau, Germany. July 5-6 2022 Industries worldwide are going through a Digitalization process towards industry 4.0 where cloud resources play a key role, forcing a transition for CAE engineers from traditional, in-house HPC to more flexible solutions in the cloud. On...

NAFEMS Webinar: Modelling & Simulation @ Tetra Pak®

Dr. Louis Carlioz, will present Tetra Pak® strategy towards en End to End capability on the upcoming NAFEMS webinar on 10th of June 2021. As can be read in the event abstract, Dr. Carlioz will go through the Modelling and Simulation strategy, and also the reasons for...