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MIT and IPC running OpenFoam in Gompute
Invenco and Gompute
Invenco and Gompute case study Business Challenge INVENCO uses numerical simulations to solve engineering problems for their customers. The company is specialized in engineering design and FEM calculations for structures and crash safety systems for...
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LS-DYNA and Formtech case study Business and engineering challenge For SME’s active in a cyclic market like motorsports it is important to be able to access HPC resources at the time of demand without the high capital expense of perpetual HPC...
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Meet the Gompute team at the Ansys Innovation Conference in Goteborg, Sweden – Nov 20 and 21, 2018
WELCOME TO GOTHENBURG From Nov 20th to 21st, we will meet at Gothia Towers in Gothenburg and focus on the cutting edge of simulation technology utilizing the ANSYS suite of tools. Join us for a packed event and get the inside scoop from users, partner experts, ANSYS...
read moreMeet the Gompute team at the Ansys Innovation conference in Madrid, Spain-November 15, 2018
Join us for our upcoming ANSYS Innovation Conference in Madrid to learn how running ANSYS simulation solutions can help solve today’s most challenging product design problems. Local customers and ANSYS technical experts will discuss how simulation-driven product...
read moreMeet the Gompute team at SC18, booth 3018
Meet the Gompute team at SC18, booth 318 Dallas TX. November 12–15, 2018 Each program in the SC Conference is dedicated to showcasing work in high-performance computing, networking, storage and analysis by the international HPC community. The core of the Conference is...
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